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1211 products

3D01100 - SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00900 - SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack
SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00800 - SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00700 - SEMI 3D7 - Guide for Alignment Mark for 3DS-IC Process
SEMI 3D7 - Guide for Alignment Mark for 3DS-IC Process Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00600 - SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration
SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00500 - SEMI 3D5 - Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
SEMI 3D5 - Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00400 - SEMI 3D4 - Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
SEMI 3D4 - Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00200 - SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications
SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00100 - SEMI 3D1 - Terminology for Through Silicon via Geometrical Metrology
SEMI 3D1 - Terminology for Through Silicon via Geometrical Metrology Sale priceMember Price: $144.00
Non-Member Price: $187.00
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