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1207 products

T02500 - SEMI T25 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications
SEMI T25 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications Sale priceMember Price: $138.00
Non-Member Price: $180.00
FH00300 - SEMI FH3 - Guide for Salt Mist and Washability Test Flow for Control Module Connector of Wearables
SEMI FH3 - Guide for Salt Mist and Washability Test Flow for Control Module Connector of Wearables Sale priceMember Price: $138.00
Non-Member Price: $180.00
D08400 - SEMI D84 - Terminology for FPD Phase Shift Mask and Mask Blanks
SEMI D84 - Terminology for FPD Phase Shift Mask and Mask Blanks Sale priceMember Price: $138.00
Non-Member Price: $180.00
M09300 - SEMI M93 - Test Method for Quantifying Basal Plane Dislocation Density in 4H-SiC by X-Ray Diffraction Topography/Imaging
SEMI M93 - Test Method for Quantifying Basal Plane Dislocation Density in 4H-SiC by X-Ray Diffraction Topography/Imaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
C10500 - SEMI C105 - Guide for Trace Iron Analysis in High Purity 2-Propanol (IPA)
SEMI C105 - Guide for Trace Iron Analysis in High Purity 2-Propanol (IPA) Sale priceMember Price: $138.00
Non-Member Price: $180.00
F12100 - SEMI F121 - Guide for Evaluating Metrology for Particle Precursors in Ultrapure Water
SEMI F121 - Guide for Evaluating Metrology for Particle Precursors in Ultrapure Water Sale priceMember Price: $267.00
Non-Member Price: $355.00
PV10100 - SEMI PV101 - Guide for Scrap Judgement of Photovoltaic Modules in Building
SEMI PV101 - Guide for Scrap Judgement of Photovoltaic Modules in Building Sale priceMember Price: $138.00
Non-Member Price: $180.00
P04900 - SEMI P49 - Specification for Experimental Curvilinear Multigon Extension to SEMI P39
SEMI P49 - Specification for Experimental Curvilinear Multigon Extension to SEMI P39 Sale priceMember Price: $138.00
Non-Member Price: $180.00
PV09800 - SEMI PV100 - Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV)
SEMI PV100 - Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV) Sale priceMember Price: $138.00
Non-Member Price: $180.00
M09200 - SEMI M92 - Specification for 4H-SIC Homoepitaxial Wafer
SEMI M92 - Specification for 4H-SIC Homoepitaxial Wafer Sale priceMember Price: $138.00
Non-Member Price: $180.00
FH00200 - SEMI FH2 - Test Method of Sheet Resistance for Woven Electronic Textiles
SEMI FH2 - Test Method of Sheet Resistance for Woven Electronic Textiles Sale priceMember Price: $138.00
Non-Member Price: $180.00
FH00100 - SEMI FH1 - Test Method of Line Impedance for Electronic Textiles
SEMI FH1 - Test Method of Line Impedance for Electronic Textiles Sale priceMember Price: $138.00
Non-Member Price: $180.00
HB01400 - SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate Sale priceMember Price: $138.00
Non-Member Price: $180.00
D08300 - SEMI D83 - Test Method for Warm-Up Properties of Display Picture Quality
SEMI D83 - Test Method for Warm-Up Properties of Display Picture Quality Sale priceMember Price: $138.00
Non-Member Price: $180.00
T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications
SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications Sale priceMember Price: $138.00
Non-Member Price: $180.00
G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
F12000 - SEMI F120 - Test Method for the Electrochemical Critical Pitting Voltage Testing of Stainless Steel Used in Corrosive Gas Systems
SEMI F120 - Test Method for the Electrochemical Critical Pitting Voltage Testing of Stainless Steel Used in Corrosive Gas Systems Sale priceMember Price: $138.00
Non-Member Price: $180.00
C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Sale priceMember Price: $138.00
Non-Member Price: $180.00
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