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Individual Standards

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1208 products

C02800 - SEMI C28 - Specification and Guide for Hydrofluoric Acid
SEMI C28 - Specification and Guide for Hydrofluoric Acid Sale priceMember Price: $138.00
Non-Member Price: $180.00
C02700 - SEMI C27 - Specification and Guide for Hydrochloric Acid
SEMI C27 - Specification and Guide for Hydrochloric Acid Sale priceMember Price: $138.00
Non-Member Price: $180.00
C02400 - SEMI C24 - Specification for n-Butyl Acetate
SEMI C24 - Specification for n-Butyl Acetate Sale priceMember Price: $138.00
Non-Member Price: $180.00
C02300 - SEMI C23 - Specification for Buffered Oxide Etchants
SEMI C23 - Specification for Buffered Oxide Etchants Sale priceMember Price: $138.00
Non-Member Price: $180.00
C02100 - SEMI C21 - Specification and Guide for Ammonium Hydroxide
SEMI C21 - Specification and Guide for Ammonium Hydroxide Sale priceMember Price: $138.00
Non-Member Price: $180.00
C02000 - SEMI C20 - Specification and Guide for Ammonium Fluoride 40%
SEMI C20 - Specification and Guide for Ammonium Fluoride 40% Sale priceMember Price: $138.00
Non-Member Price: $180.00
C01900 - SEMI C19 - Specification for Acetone
SEMI C19 - Specification for Acetone Sale priceMember Price: $138.00
Non-Member Price: $180.00
C01800 - SEMI C18 - Specification for Acetic Acid
SEMI C18 - Specification for Acetic Acid Sale priceMember Price: $138.00
Non-Member Price: $180.00
C01500 - SEMI C15 - Test Method for ppm and ppb Humidity Standards
SEMI C15 - Test Method for ppm and ppb Humidity Standards Sale priceMember Price: $138.00
Non-Member Price: $180.00
C01400 - SEMI C14 - Test Method for Particle Shedding Performance of 25 cm Gas Filter Cartridges
C00100 - SEMI C1 - Guide for the Analysis of Liquid Chemicals
C01000 - SEMI C10 - MDL(定量下限値)決定に関するガイド
SEMI C10 - MDL(定量下限値)決定に関するガイド Sale priceMember Price: $321.00
Non-Member Price: $427.00
C01000 - SEMI C10 - Guide for Determination of Method Detection Limits
SEMI C10 - Guide for Determination of Method Detection Limits Sale priceMember Price: $267.00
Non-Member Price: $355.00
A00100 - SEMI A1 - Specification for Production Equipment Smart Connection Interface (PESCI)
SEMI A1 - Specification for Production Equipment Smart Connection Interface (PESCI) Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01800 - SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process
SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology
SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging
SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01500 - SEMI 3D15 - Guide for Overlay Performance Assessment for 3DS-IC Process
SEMI 3D15 - Guide for Overlay Performance Assessment for 3DS-IC Process Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01400 - SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products
3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks
SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers
SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D01100 - SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
3D00900 - SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack
SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $138.00
Non-Member Price: $180.00
3D00800 - SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
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