SEMI Standards

SEMI International Standards form the foundation for innovation in the microelectronics industry. The SEMI Standards process has been used to create more than 1,000 industry approved Standards and Safety Guidelines, based on the work of more than 5,000 volunteers in key topics including safety, materials, packaging, traceability and cybersecurity. For 50 years, SEMI Standards have helped reduce manufacturing complexity, which enables customer cost reduction, improved supplier quality, and shorter time-to-market. Each year, more than 1,000 companies purchase and use SEMI Standards to improve manufacturing operations.

Individual SEMI Standards

SEMI Standards and Safety Guidelines are provided in PDF format and protected by Digital Rights Management (DRM). To open DRM-protected PDFs, users must install Adobe Acrobat and the FileOpen DRM plug-in. Devices and operating systems must meet FileOpen compatibility requirements. For more information, see the SEMI DRM FAQ.

 

SEMI Standards individual downloads are licensed to a single user for use on a single authorized device and may not be copied, shared, transferred, distributed, or otherwise made available to others. Organizations requiring access for multiple users should contact their local SEMI office.

 

SEMI Standards content may not be used with artificial intelligence (AI) or machine-learning systems, including for training, fine-tuning, retrieval, grounding, prompt development, automated analysis, or content generation. SEMI does not currently offer licensing or permission for these uses. Questions may be directed to standardspublishing@semi.org.


G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads
SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $148.00
Non-Member Price: $150.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02900 - SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $148.00
Non-Member Price: $193.00
G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip
SEMI G32 - Guideline for Unencapsulated Thermal Test Chip Sale priceMember Price: $148.00
Non-Member Price: $193.00
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $148.00
Non-Member Price: $150.00
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
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