SEMI Standards

SEMI International Standards form the foundation for innovation in the microelectronics industry. The SEMI Standards process has been used to create more than 1,000 industry approved Standards and Safety Guidelines, based on the work of more than 5,000 volunteers in key topics including safety, materials, packaging, traceability and cybersecurity. For 50 years, SEMI Standards have helped reduce manufacturing complexity, which enables customer cost reduction, improved supplier quality, and shorter time-to-market. Each year, more than 1,000 companies purchase and use SEMI Standards to improve manufacturing operations.

Individual SEMI Standards

SEMI Standards and Safety Guidelines are provided in PDF format and protected by Digital Rights Management (DRM). To open DRM-protected PDFs, users must install Adobe Acrobat and the FileOpen DRM plug-in. Devices and operating systems must meet FileOpen compatibility requirements. For more information, see the SEMI DRM FAQ.

 

SEMI Standards individual downloads are licensed to a single user for use on a single authorized device and may not be copied, shared, transferred, distributed, or otherwise made available to others. Organizations requiring access for multiple users should contact their local SEMI office.

 

SEMI Standards content may not be used with artificial intelligence (AI) or machine-learning systems, including for training, fine-tuning, retrieval, grounding, prompt development, automated analysis, or content generation. SEMI does not currently offer licensing or permission for these uses. Questions may be directed to standardspublishing@semi.org.


G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes
SEMI G21 - Specification for Plating Integrated Circuit Leadframes Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $148.00
Non-Member Price: $150.00
G02300 - SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages
SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法
G02400 - SEMI G24 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
G02400 - SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法
G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads
SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02500 - SEMI G25 - パッケージ・リード抵抗の測定のための試験方法
SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $148.00
Non-Member Price: $150.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様
G02900 - SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法
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