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G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $171.00
Non-Member Price: $180.00
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $144.00
Non-Member Price: $150.00
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: $144.00
Non-Member Price: $187.00
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
T00600 - SEMI T6 - Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI)
T00200 - SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix
SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix Sale priceMember Price: $144.00
Non-Member Price: $187.00
T01600 - SEMI T16 - 極紫外線マスク自動識別用データマトリクス記号法適用の仕様
T01500 - SEMI T15 - 治具IDの一般仕様 (コンセプト)
SEMI T15 - 治具IDの一般仕様 (コンセプト) Sale priceMember Price: $171.00
Non-Member Price: $224.00
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers Sale priceMember Price: $278.00
Non-Member Price: $369.00
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: $278.00
Non-Member Price: $369.00
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: $278.00
Non-Member Price: $369.00
P00900 - SEMI P9 - マイクロエレクトロニクス用レジストの機能的なテスト(ガイドライン)
P00800 - SEMI P8 - フォトレジスト中の水分の測定方法
SEMI P8 - フォトレジスト中の水分の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
P00700 - SEMI P7 - 粘性決定方法,方法A-動粘度
SEMI P7 - 粘性決定方法,方法A-動粘度 Sale priceMember Price: $171.00
Non-Member Price: $224.00
P00500 - SEMI P5 - ペリクルの仕様
SEMI P5 - ペリクルの仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00
P04700 - SEMI P47 - ラインエッジラフネス(Line Edge Roughness)およびライン幅ラフネス(Line Width Roughness)測定の試験方法