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SEMI PV100 - Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV) Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI M92 - Specification for 4H-SIC Homoepitaxial Wafer Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI FH2 - Test Method of Sheet Resistance for Woven Electronic Textiles Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI FH1 - Test Method of Line Impedance for Electronic Textiles Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI D83 - Test Method for Warm-Up Properties of Display Picture Quality Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI F120 - Test Method for the Electrochemical Critical Pitting Voltage Testing of Stainless Steel Used in Corrosive Gas Systems Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI PV73 - Test Method for Thin-Film Silicon Photovoltaic (PV) Modules Light Soaking Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI M91 - Test Method for Determination of Threading Screw Dislocation Density in 4H-SIC by X-Ray Topography Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI MS14 - Guide for Critical Parameters of Gas Sensors Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI T7-0516 (Reapproved 0422) - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI E188 - Specification for Malware Free Equipment Integration Sale priceMember Price: $278.00
Non-Member Price: $369.00

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SEMI F3 - Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI F2 - Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南 Sale priceMember Price: $144.00
Non-Member Price: $187.00