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testing

1629 products

G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法(提案)
G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package
SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法
SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $144.00
Non-Member Price: $187.00
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength
SEMI G63 - Test Method for Measurement of Die Shear Strength Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02900 - SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads
SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02400 - SEMI G24 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: $144.00
Non-Member Price: $187.00
G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds
SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: $144.00
Non-Member Price: $187.00
F05600 - SEMI F56 - Test Method for Determining Steady-State Supply Voltage Effects for Mass Flow Controllers
F02600 - SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases
F06900 - SEMI F69 - Test Method for Transport and Shock Testing of Gas Delivery Systems
SEMI F69 - Test Method for Transport and Shock Testing of Gas Delivery Systems Sale priceMember Price: $144.00
Non-Member Price: $187.00