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1629 products

M02300 - SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers
SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers Sale priceMember Price: $144.00
Non-Member Price: $187.00
M02100 - SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array
SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array Sale priceMember Price: $144.00
Non-Member Price: $187.00
M01700 - SEMI M17 - Guide for a Universal Wafer Grid
SEMI M17 - Guide for a Universal Wafer Grid Sale priceMember Price: $144.00
Non-Member Price: $187.00
M01700 - SEMI M17 - 一般的なウェーハグリッドのガイド
SEMI M17 - 一般的なウェーハグリッドのガイド Sale priceMember Price: $171.00
Non-Member Price: $224.00
M01600 - SEMI M16 - Specification for Polycrystalline Silicon
SEMI M16 - Specification for Polycrystalline Silicon Sale priceMember Price: $144.00
Non-Member Price: $187.00
M01600 - SEMI M16 - 多結晶シリコンの仕様
SEMI M16 - 多結晶シリコンの仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00
HB00900 - SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED
HB00800 - SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal
SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal Sale priceMember Price: $144.00
Non-Member Price: $187.00
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
HB00600 - SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $144.00
Non-Member Price: $187.00
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
G08900 - SEMI G89 - Specification for Leadframe Strip Size
SEMI G89 - Specification for Leadframe Strip Size Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages
G06200 - SEMI G62 - Test Method for Silver Plating Quality
SEMI G62 - Test Method for Silver Plating Quality Sale priceMember Price: $144.00
Non-Member Price: $187.00
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: $144.00
Non-Member Price: $187.00