Individual Standards

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1215 products

G08300 - SEMI G83 - Specification for Bar Code Marking of Product Packages
SEMI G83 - Specification for Bar Code Marking of Product Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様
G02500 - SEMI G25 - パッケージ・リード抵抗の測定のための試験方法
SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G02400 - SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法
G01500 - SEMI G15 - モールディングコンパウンド示差走査熱量分析の標準試験方法
G01300 - SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法
SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package
SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $144.00
Non-Member Price: $187.00
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
G01000 - SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes
SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07000 - SEMI G70 - Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength
SEMI G63 - Test Method for Measurement of Die Shear Strength Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02900 - SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
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