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G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $148.00
Non-Member Price: $150.00
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $176.00
Non-Member Price: $180.00
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $148.00
Non-Member Price: $150.00
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $148.00
Non-Member Price: $150.00
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: $148.00
Non-Member Price: $193.00
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
T00700 - SEMI T7 - 二次元マトリクスコードシンボルの両面研磨ウェーハ裏面マーキングの仕様
T00600 - SEMI T6 - Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI)
T00200 - SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix
SEMI T2 - Specification for Marking of Wafers With a Two Dimensional Dot Matrix Sale priceMember Price: $148.00
Non-Member Price: $193.00
T01600 - SEMI T16 - 極紫外線マスク自動識別用データマトリクス記号法適用の仕様
T01500 - SEMI T15 - 治具IDの一般仕様 (コンセプト)
SEMI T15 - 治具IDの一般仕様 (コンセプト) Sale priceMember Price: $176.00
Non-Member Price: $231.00
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers Sale priceMember Price: $286.00
Non-Member Price: $380.00
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: $286.00
Non-Member Price: $380.00
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: $286.00
Non-Member Price: $380.00
T01000 - SEMI T10 - 二次元データマトリクス直接マーク品質を評価する試験方法