SEMI Standards

SEMI International Standards form the foundation for innovation in the microelectronics industry. The SEMI Standards process has been used to create more than 1,000 industry approved Standards and Safety Guidelines, based on the work of more than 5,000 volunteers in key topics including safety, materials, packaging, traceability and cybersecurity. For 50 years, SEMI Standards have helped reduce manufacturing complexity, which enables customer cost reduction, improved supplier quality, and shorter time-to-market. Each year, more than 1,000 companies purchase and use SEMI Standards to improve manufacturing operations.

Individual SEMI Standards

SEMI Standards and Safety Guidelines are provided in PDF format and protected by Digital Rights Management (DRM). To open DRM-protected PDFs, users must install Adobe Acrobat and the FileOpen DRM plug-in. Devices and operating systems must meet FileOpen compatibility requirements. For more information, see the SEMI DRM FAQ.

 

SEMI Standards individual downloads are licensed to a single user for use on a single authorized device and may not be copied, shared, transferred, distributed, or otherwise made available to others. Organizations requiring access for multiple users should contact their local SEMI office.

 

SEMI Standards content may not be used with artificial intelligence (AI) or machine-learning systems, including for training, fine-tuning, retrieval, grounding, prompt development, automated analysis, or content generation. SEMI does not currently offer licensing or permission for these uses. Questions may be directed to standardspublishing@semi.org.


G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
HB00600 - SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
HB00800 - SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal
SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00900 - SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED
HB01000 - SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers
HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers
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