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G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05500 - SEMI G55 - リードフレーム銀めっき光沢度の測定方法
SEMI G55 - リードフレーム銀めっき光沢度の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05600 - SEMI G56 - リードフレーム銀めっき厚さの測定方法
SEMI G56 - リードフレーム銀めっき厚さの測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: $171.00
Non-Member Price: $180.00
G05800 - SEMI G58 - Specification for Cerquad Package Constructions
SEMI G58 - Specification for Cerquad Package Constructions Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
G05900 - SEMI G59 - リードフレーム挿間紙上のイオン汚染物および挿間紙からリードフレームに移る汚染物の測定方法
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
G06000 - SEMI G60 - 半導体リードフレーム挿間紙材料の静電特性の測定方法
SEMI G60 - 半導体リードフレーム挿間紙材料の静電特性の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G06100 - SEMI G61 - Specification for Cofired Ceramic Packages
SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00
G06200 - SEMI G62 - Test Method for Silver Plating Quality
SEMI G62 - Test Method for Silver Plating Quality Sale priceMember Price: $144.00
Non-Member Price: $187.00
G06200 - SEMI G62 - 銀めっきの試験方法
SEMI G62 - 銀めっきの試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength
SEMI G63 - Test Method for Measurement of Die Shear Strength Sale priceMember Price: $144.00
Non-Member Price: $187.00
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)
G06400 - SEMI G64 - 全面めっきIC用リードフレーム(金,銀,銅,ニッケル,パラジウム/ニッケル,およびパラジウム)の仕様
G06500 - SEMI G65 - Lリード(ガルウイング型)パッケージ用リードフレーム材料の評価の試験方法
G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages
G06600 - SEMI G66 - Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法