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M00600 - SEMI M6 - 太陽光電池用シリコンウェーハの仕様
SEMI M6 - 太陽光電池用シリコンウェーハの仕様 Sale priceMember Price: $176.00
Non-Member Price: $180.00
M06100 - SEMI M61 - Specification for Silicon Epitaxial Wafers with Buried Layers
SEMI M61 - Specification for Silicon Epitaxial Wafers with Buried Layers Sale priceMember Price: $148.00
Non-Member Price: $193.00
M06000 - SEMI M60 - Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation
M05700 - SEMI M57 - Specification for Silicon Annealed Wafers
SEMI M57 - Specification for Silicon Annealed Wafers Sale priceMember Price: $148.00
Non-Member Price: $193.00
M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
M05100 - SEMI M51 - Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
SEMI M51 - Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity Sale priceMember Price: $148.00
Non-Member Price: $193.00
M04900 - SEMI M49 - Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 3 nm Technology Generations
M04400 - SEMI M44 - シリコン中の酸素の換算係数ガイド
SEMI M44 - シリコン中の酸素の換算係数ガイド Sale priceMember Price: $176.00
Non-Member Price: $231.00
M02100 - SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array
SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array Sale priceMember Price: $148.00
Non-Member Price: $193.00
M01700 - SEMI M17 - Guide for a Universal Wafer Grid
SEMI M17 - Guide for a Universal Wafer Grid Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
HB00600 - SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
G08900 - SEMI G89 - Specification for Leadframe Strip Size
SEMI G89 - Specification for Leadframe Strip Size Sale priceMember Price: $148.00
Non-Member Price: $193.00
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
G02300 - SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages
SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer
SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Sale priceMember Price: $148.00
Non-Member Price: $193.00
G09500 - SEMI G95 - Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in the Backend Process
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $148.00
Non-Member Price: $193.00
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