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SEMI C3.37 - Specification for Hexafluoroethane (C2F6), 99.97% Quality Sale priceMember Price: $138.00
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SEMI C3.35 - 塩化水素（HCl），品質99.997%の仕様 Sale priceMember Price: $164.00
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SEMI C3.32 - Specification for Chlorine (Cl2), 99.996% Quality Sale priceMember Price: $138.00
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SEMI C3.27 - Specification for Boron Trifluoride (BF3) in Cylinders, 99.0% Quality Sale priceMember Price: $138.00
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SEMI C3.2 - Specification for Arsine (AsH3) in Cylinders, 99.94% Quality Sale priceMember Price: $138.00
Non-Member Price: $180.00

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SEMI C29 - Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v) Sale priceMember Price: $138.00
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SEMI C23 - Specification for Buffered Oxide Etchants Sale priceMember Price: $138.00
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SEMI C20 - Specification and Guide for Ammonium Fluoride 40% Sale priceMember Price: $138.00
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SEMI C18 - Specification for Acetic Acid Sale priceMember Price: $138.00
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SEMI C15 - PPMおよびPPB水分標準のためのテスト方法 Sale priceMember Price: $164.00
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SEMI C14 - Test Method for Particle Shedding Performance of 25 cm Gas Filter Cartridges Sale priceMember Price: $138.00
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SEMI 3D1 - スルーシリコンビア（TSV）の幾何学的計測のための用語 Regular price$300.00 USD Sale price$215.00 USD

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SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology Sale priceMember Price: $138.00
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SEMI 3D15 - Guide for Overlay Performance Assessment for 3DS-IC Process Sale priceMember Price: $138.00
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SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products Sale priceMember Price: $138.00
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SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology Sale priceMember Price: $138.00
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SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $138.00
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SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process Sale priceMember Price: $138.00
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SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration Sale priceMember Price: $138.00
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SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $138.00
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