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Individual Standards

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1208 products

M01900 - SEMI M19 - Specification for Electrical Properties of Bulk Gallium Arsenide Single Crystal Substrates
M01800 - SEMI M18 - シリコンウェーハ発注仕様書開発のガdイド
SEMI M18 - シリコンウェーハ発注仕様書開発のガdイド Sale priceMember Price: $164.00
Non-Member Price: $215.00
M01500 - SEMI M15 - 半絶縁ガリウムヒ素ウェーハ用の鏡面ウェーハの許容表面欠陥表
M01500 - SEMI M15 - Polished Wafer Defect Limits Table for Semi-Insulating Gallium Arsenide Wafers
M01400 - SEMI M14 - 半絶縁ガリウムヒ素単結晶のためのイオン注入及び活性化プロセス(仕様)
M01400 - SEMI M14 - Specification for Ion Implantation and Activation Process for Semi-Insulating Gallium Arsenide Single Crystals
M00100 - SEMI M1 - 鏡面単結晶シリコンウェーハの仕様
SEMI M1 - 鏡面単結晶シリコンウェーハの仕様 Sale priceMember Price: $321.00
Non-Member Price: $427.00
MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices
MS00700 - SEMI MS7 - Specification for Microfluidic Interfaces to Electronic Device Packages
MS00600 - SEMI MS6 - Guide for Design and Materials for Interfacing Microfluidic Systems
MS00800 - SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages
MS00500 - SEMI MS5 - Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures
MS00400 - SEMI MS4 - Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance
MS00300 - SEMI MS3 - Terminology for MEMS Technology
SEMI MS3 - Terminology for MEMS Technology Sale priceMember Price: $138.00
Non-Member Price: $180.00
MS00200 - SEMI MS2 - Test Method for Step Height Measurements of Thin Films
SEMI MS2 - Test Method for Step Height Measurements of Thin Films Sale priceMember Price: $138.00
Non-Member Price: $180.00
MS01100 - SEMI MS11 - Specification for Microfluidic Port and Pitch Dimensions
SEMI MS11 - Specification for Microfluidic Port and Pitch Dimensions Sale priceMember Price: $138.00
Non-Member Price: $180.00
MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets
SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Sale priceMember Price: $138.00
Non-Member Price: $180.00
MS01000 - SEMI MS10 - Test Method to Measure Fluid Permeation Through MEMS Packaging Materials
SEMI MS10 - Test Method to Measure Fluid Permeation Through MEMS Packaging Materials Sale priceMember Price: $138.00
Non-Member Price: $180.00
E00400 - SEMI E4 - 半導体製造装置通信スタンダード1 メッセージトランスファ(SECS-I)
E03700 - SEMI E37 - 高速SECSメッセージサービス(HSMS)汎用サービス
SEMI E37 - 高速SECSメッセージサービス(HSMS)汎用サービス Sale priceMember Price: $321.00
Non-Member Price: $427.00
E03000 - SEMI E30 - 製造装置の通信およびコントロールのための包括的モデル(GEM)
E15400 - SEMI E154 - 450 mmロードポートのためのメカニカルインタフェースの仕様
A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH)
SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Sale priceMember Price: $138.00
Non-Member Price: $180.00
S00800 - SEMI S8 - 半導體製造設備人因工程之安全基準
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