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Individual Standards

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1208 products

G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: $164.00
Non-Member Price: $215.00
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers Sale priceMember Price: $267.00
Non-Member Price: $355.00
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: $267.00
Non-Member Price: $355.00
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: $267.00
Non-Member Price: $355.00
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
G08500 - SEMI G85 - Specification for Map Data Format
SEMI G85 - Specification for Map Data Format Sale priceMember Price: $138.00
Non-Member Price: $180.00
G08500 - SEMI G85 - マップデータ・フォーマット用仕様
SEMI G85 - マップデータ・フォーマット用仕様 Sale priceMember Price: $164.00
Non-Member Price: $215.00
G08000 - SEMI G80 - Test Method for the Analysis of Overall Digital Timing Accuracy for Automated Test Equipment
G00800 - SEMI G8 - Test Method for Gold Plating
SEMI G8 - Test Method for Gold Plating Sale priceMember Price: $138.00
Non-Member Price: $180.00
G07900 - SEMI G79 - Specification for Overall Digital Timing Accuracy
SEMI G79 - Specification for Overall Digital Timing Accuracy Sale priceMember Price: $138.00
Non-Member Price: $180.00
G07600 - SEMI G76 - Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP)
G07200 - SEMI G72 - Specification for Ball Grid Array Design Library
SEMI G72 - Specification for Ball Grid Array Design Library Sale priceMember Price: $138.00
Non-Member Price: $180.00
G05800 - SEMI G58 - Specification for Cerquad Package Constructions
SEMI G58 - Specification for Cerquad Package Constructions Sale priceMember Price: $138.00
Non-Member Price: $180.00
G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching
SEMI G19 - Specification for Dip Leadframes Produced by Etching Sale priceMember Price: $138.00
Non-Member Price: $180.00
G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip
SEMI G32 - Guideline for Unencapsulated Thermal Test Chip Sale priceMember Price: $138.00
Non-Member Price: $180.00
G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
PV00400 - SEMI PV4 - Specification for Range of 5th Generation Substrate Sizes for Thin Film Photovoltaic Applications
P00800 - SEMI P8 - Test Method for the Determination of Water in Photoresist
SEMI P8 - Test Method for the Determination of Water in Photoresist Sale priceMember Price: $138.00
Non-Member Price: $180.00
P00700 - SEMI P7 - Test Method of Viscosity Determination, Method A - Kinematic Viscosity
SEMI P7 - Test Method of Viscosity Determination, Method A - Kinematic Viscosity Sale priceMember Price: $138.00
Non-Member Price: $180.00
P00600 - SEMI P6 - フォトマスク用レジストレーションマーク
SEMI P6 - フォトマスク用レジストレーションマーク Sale priceMember Price: $164.00
Non-Member Price: $215.00
P00600 - SEMI P6 - Specification for Registration Marks for Photomasks
SEMI P6 - Specification for Registration Marks for Photomasks Sale priceMember Price: $138.00
Non-Member Price: $180.00
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