Individual Standards

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1213 products

G00300 - SEMI G3 - Specification for Sidebrazed Laminates
SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: $144.00
Non-Member Price: $187.00
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $150.00
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $150.00
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: $144.00
Non-Member Price: $150.00
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: $144.00
Non-Member Price: $150.00
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $171.00
Non-Member Price: $180.00
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $180.00
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $144.00
Non-Member Price: $150.00
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: $144.00
Non-Member Price: $187.00
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様
SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Sale priceMember Price: $171.00
Non-Member Price: $180.00
G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Sale priceMember Price: $144.00
Non-Member Price: $187.00
G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $187.00
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers Sale priceMember Price: $278.00
Non-Member Price: $369.00
T01300 - SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services
SEMI T13 - Specification for Device Tracking: Concepts, Behavior, and Services Sale priceMember Price: $278.00
Non-Member Price: $369.00
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: $278.00
Non-Member Price: $369.00
G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) Sale priceMember Price: $144.00
Non-Member Price: $187.00
G08500 - SEMI G85 - Specification for Map Data Format
SEMI G85 - Specification for Map Data Format Sale priceMember Price: $144.00
Non-Member Price: $187.00
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