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Individual Standards

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1207 products

G00500 - SEMI G5 - Standard for Ceramic Chip Carriers
SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: $138.00
Non-Member Price: $180.00
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: $138.00
Non-Member Price: $150.00
G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: $138.00
Non-Member Price: $150.00
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: $138.00
Non-Member Price: $150.00
G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: $138.00
Non-Member Price: $150.00
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: $138.00
Non-Member Price: $150.00
G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: $138.00
Non-Member Price: $150.00
G00300 - SEMI G3 - Specification for Sidebrazed Laminates
SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: $138.00
Non-Member Price: $180.00
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: $164.00
Non-Member Price: $215.00
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $138.00
Non-Member Price: $150.00
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $164.00
Non-Member Price: $180.00
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: $164.00
Non-Member Price: $180.00
G00200 - SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $164.00
Non-Member Price: $215.00
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: $138.00
Non-Member Price: $180.00
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages Sale priceMember Price: $138.00
Non-Member Price: $150.00
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids Sale priceMember Price: $138.00
Non-Member Price: $150.00
G02200 - SEMI G22 - Specification for Ceramic Pin Grid Array Packages
SEMI G22 - Specification for Ceramic Pin Grid Array Packages Sale priceMember Price: $138.00
Non-Member Price: $150.00
G00100 - SEMI G1 - Specification for Cerdip Package Constructions
SEMI G1 - Specification for Cerdip Package Constructions Sale priceMember Price: $138.00
Non-Member Price: $180.00
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造
SEMI G1 - 仕様Cer-DIPパッケージ構造 Sale priceMember Price: $164.00
Non-Member Price: $215.00
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