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1845 products

M01000 - SEMI M10 - Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers
SEMI M10 - Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00900 - SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED
SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00800 - SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal
SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00600 - SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $148.00
Non-Member Price: $193.00
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices Sale priceMember Price: $148.00
Non-Member Price: $193.00
G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer Sale priceMember Price: $148.00
Non-Member Price: $193.00
G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)
SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) Sale priceMember Price: $148.00
Non-Member Price: $193.00
G08900 - SEMI G89 - Specification for Leadframe Strip Size
SEMI G89 - Specification for Leadframe Strip Size Sale priceMember Price: $148.00
Non-Member Price: $193.00
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials Sale priceMember Price: $148.00
Non-Member Price: $193.00
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Sale priceMember Price: $148.00
Non-Member Price: $193.00
G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages
SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G06200 - SEMI G62 - Test Method for Silver Plating Quality
SEMI G62 - Test Method for Silver Plating Quality Sale priceMember Price: $148.00
Non-Member Price: $193.00
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials Sale priceMember Price: $148.00
Non-Member Price: $193.00
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: $148.00
Non-Member Price: $193.00
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: $148.00
Non-Member Price: $193.00
G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02300 - SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages
SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes Sale priceMember Price: $148.00
Non-Member Price: $193.00