Newest Products

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SEMI G6 - 検査方法　封止リング平坦度 Sale priceMember Price: $171.00
Non-Member Price: $180.00

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SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: $171.00
Non-Member Price: $180.00

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SEMI G5 - 仕様　セラミックチップキャリア（CCC） Sale priceMember Price: $171.00
Non-Member Price: $187.00

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SEMI G5 - Standard for Ceramic Chip Carriers Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: $144.00
Non-Member Price: $150.00

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SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: $171.00
Non-Member Price: $180.00

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SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $180.00

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SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00