Market Data

Newest Products

2229 products

G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes
SEMI G21 - Specification for Plating Integrated Circuit Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00
G04100 - SEMI G41 - Specification for Dual Strip SOIC Leadframe
SEMI G41 - Specification for Dual Strip SOIC Leadframe Sale priceMember Price: $144.00
Non-Member Price: $187.00
G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer
SEMI G88 - Specification for Tape Frame for 450 mm Wafer Sale priceMember Price: $144.00
Non-Member Price: $187.00
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
G08200 - SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process
SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process Sale priceMember Price: $144.00
Non-Member Price: $187.00
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape
SEMI G75 - Standard Test Method of the Properties of Leadframe Tape Sale priceMember Price: $144.00
Non-Member Price: $187.00
G08100 - SEMI G81 - Specification for Map Data Items
SEMI G81 - Specification for Map Data Items Sale priceMember Price: $144.00
Non-Member Price: $187.00
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer
SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Sale priceMember Price: $144.00
Non-Member Price: $187.00
G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers
SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07400 - SEMI G74 - Specification for Tape Frame for 300 mm Wafers
SEMI G74 - Specification for Tape Frame for 300 mm Wafers Sale priceMember Price: $144.00
Non-Member Price: $187.00
G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending
G09500 - SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様
G09500 - SEMI G95 - Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in the Backend Process
G09300 - SEMI G93 - ボール・グリッド・アレイ(BGA)パッケージ用はんだボールの測定方法
G08300 - SEMI G83 - Specification for Bar Code Marking of Product Packages
SEMI G83 - Specification for Bar Code Marking of Product Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G05500 - SEMI G55 - リードフレーム銀めっき光沢度の測定方法
SEMI G55 - リードフレーム銀めっき光沢度の測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
G04300 - SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法
G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法