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SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G15 - モールディングコンパウンド示差走査熱量分析の標準試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案） Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 Sale priceMember Price: $171.00
Non-Member Price: $224.00

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SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G70 - Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G63 - Test Method for Measurement of Die Shear Strength Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes Sale priceMember Price: $144.00
Non-Member Price: $187.00

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SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00