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2229 products

HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: $144.00
Non-Member Price: $187.00
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
HB01000 - SEMI HB10 - Specification for Single Crystal Sapphire Intended for Use for Manufacturing HB-LED Wafers
G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)
G08900 - SEMI G89 - Specification for Leadframe Strip Size
SEMI G89 - Specification for Leadframe Strip Size Sale priceMember Price: $144.00
Non-Member Price: $187.00
G07100 - SEMI G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
G06700 - SEMI G67 - Test Method for the Measurement of Particle Generation from Sheet Materials
SEMI G67 - Test Method for the Measurement of Particle Generation from Sheet Materials Sale priceMember Price: $144.00
Non-Member Price: $187.00
G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
G06600 - SEMI G66 - Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages
G06200 - SEMI G62 - Test Method for Silver Plating Quality
SEMI G62 - Test Method for Silver Plating Quality Sale priceMember Price: $144.00
Non-Member Price: $187.00
G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness
SEMI G56 - Test Method for Measurement of Silver Plating Thickness Sale priceMember Price: $144.00
Non-Member Price: $187.00
G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
G02300 - SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages
SEMI G23 - Test Method of Inductance for Internal Traces of Semiconductor Packages Sale priceMember Price: $144.00
Non-Member Price: $187.00
G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling
SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: $144.00
Non-Member Price: $187.00