Standards

SEMI Standards form the foundation for innovation in the microelectronics industry. The SEMI Standards process has been used to create more than 1000 industry approved standards and guidelines, based on the work of more than 5,000 volunteers.

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G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
G04300 - SEMI G43 - プラスチックモールドパッケージのジャンクション部とケース間の熱抵抗のための試験方法
G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法
G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様
G02500 - SEMI G25 - パッケージ・リード抵抗の測定のための試験方法
SEMI G25 - パッケージ・リード抵抗の測定のための試験方法 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G02400 - SEMI G24 - パッケージ・リード間の容量および付加容量の測定のための試験方法
G01500 - SEMI G15 - モールディングコンパウンド示差走査熱量分析の標準試験方法
G01300 - SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法
SEMI G13 - モールディングコンパウンドの膨張特性の標準試験方法 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G01100 - SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法(提案)
G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package
SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package Sale priceMember Price: $148.00
Non-Member Price: $193.00
G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法
SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 Sale priceMember Price: $176.00
Non-Member Price: $231.00
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: $148.00
Non-Member Price: $193.00
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds Sale priceMember Price: $148.00
Non-Member Price: $193.00
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
G01000 - SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes
SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes Sale priceMember Price: $148.00
Non-Member Price: $193.00
G07000 - SEMI G70 - Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength
SEMI G63 - Test Method for Measurement of Die Shear Strength Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02900 - SEMI G29 - Test Method for Trace Contaminants in Molding Compounds
SEMI G29 - Test Method for Trace Contaminants in Molding Compounds Sale priceMember Price: $148.00
Non-Member Price: $193.00
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: $148.00
Non-Member Price: $193.00
G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes Sale priceMember Price: $148.00
Non-Member Price: $193.00
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages
SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads
SEMI G25 - Test Method for Measuring the Resistance of Package Leads Sale priceMember Price: $148.00
Non-Member Price: $193.00
G02400 - SEMI G24 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: $148.00
Non-Member Price: $193.00
G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds
SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds Sale priceMember Price: $148.00
Non-Member Price: $193.00
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: $148.00
Non-Member Price: $193.00
F05500 - SEMI F55 - Test Method for Determining the Corrosion Resistance of Mass Flow Controllers
F10100 - SEMI F101 - Test Method for Determining Pressure Regulator Performance in Gas Distribution Systems
F05600 - SEMI F56 - Test Method for Determining Steady-State Supply Voltage Effects for Mass Flow Controllers
F06300 - SEMI F63 - Guide for Ultrapure Water Used in Semiconductor Processing
SEMI F63 - Guide for Ultrapure Water Used in Semiconductor Processing Sale priceMember Price: $286.00
Non-Member Price: $380.00
F04000 - SEMI F40 - Practice for Preparing Liquid Chemical Distribution Components and Neat Polymers for Chemical Testing
F04400 - SEMI F44 - Specification for Machined Stainless Steel Weld Fittings
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
F03400 - SEMI F34 - Guide for Liquid Chemical Pipe Labeling
SEMI F34 - Guide for Liquid Chemical Pipe Labeling Sale priceMember Price: $148.00
Non-Member Price: $193.00
F11000 - SEMI F110 - Test Method for Mono-Dispersed Polystyrene Latex (PSL) Challenge of Liquid Filters
F09800 - SEMI F98 - Guide for Treatment of Reuse Water in Semiconductor Processing
F02300 - SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen
SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen Sale priceMember Price: $148.00
Non-Member Price: $193.00
F02200 - SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems
SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems Sale priceMember Price: $148.00
Non-Member Price: $193.00
F05400 - SEMI F54 - Test Method for Measuring the Counting Efficiency of Condensation Nucleus Counters
F03700 - SEMI F37 - Test Method for Determination of Surface Roughness Parameters for Gas Distribution System Components
F06400 - SEMI F64 - Test Method for Determining Pressure Effects on Indicated and Actual Flow for Mass Flow Controllers
F07600 - SEMI F76 - Test Method for Evaluation of Particle Contribution from Gas System Components Exposed to Corrosive Gas
F02600 - SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases