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SEMI Standards form the foundation for innovation in the microelectronics industry. The SEMI Standards process has been used to create more than 1000 industry approved standards and guidelines, based on the work of more than 5,000 volunteers.
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SEMI M59 - Terminology for Silicon Technology
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SEMI M59 - シリコン技術の用語集
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SEMI M58 - Test Method for Evaluating DMA Based Particle Deposition Systems and Processes
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SEMI M58 - DMAを基にしたパーティクル堆積システムとプロセス評価のためのテスト方法
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Non-Member Price: $224.00
SEMI M57 - Specification for Silicon Annealed Wafers
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Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
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SEMI M55 - Specification for Polished Monocrystalline Silicon Carbide Wafers
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SEMI M54 - Guide for Semi-Insulating (SI) GaAs Material Parameters
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SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド
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SEMI M53 - Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces
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SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations
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SEMI M51 - Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
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SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
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Non-Member Price: $187.00
SEMI M49 - Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations
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SEMI M46 - Test Method for Measuring Carrier Concentrations in Epitaxial Layer Structures by ECV Profiling
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SEMI M46 - ECV法によりエピタキシァル層内のキャリア密度プロファイルを測定するための試験方法
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SEMI M45 - Specification for 300 mm Wafer Shipping System
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SEMI M44 - Guide to Conversion Factors for Interstitial Oxygen in Silicon
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SEMI M44 - シリコン中の酸素の換算係数ガイド
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SEMI M43 - Guide for Reporting Wafer Nanotopography
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SEMI M42 - Specification for Compound Semiconductor Epitaxial Wafers
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SEMI M42 - 化合物半導体エピタキシャルウェーハの仕様
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SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様
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SEMI M41 - Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
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SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
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SEMI M40 - シリコンウェーハ表面のラフネス測定のガイド
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SEMI M38 - Specification for Polished Reclaimed Silicon Wafers
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SEMI M35 - Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection
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SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド
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SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
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SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers
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SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array
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SEMI M20 - Practice for Establishing a Wafer Coordinate System
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SEMI M17 - Guide for a Universal Wafer Grid
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SEMI M17 - 一般的なウェーハグリッドのガイド
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SEMI M16 - Specification for Polycrystalline Silicon
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SEMI M16 - 多結晶シリコンの仕様
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Non-Member Price: $224.00
SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers
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SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers
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SEMI M1 - Specification for Polished Single Crystal Silicon Wafers
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Non-Member Price: $369.00
SEMI M10 - Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers
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SEMI HB9 - Test Method and Acceptance Criteria for Visual Inspection of Surface Defects of GaN Epitaxial Wafers Used for Manufacturing HB-LED
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SEMI HB8 - Test Method for Determining Orientation of a Sapphire Single Crystal
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SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
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SEMI HB6 - Test Method for Measurement of Thickness and Shape of Crystalline Sapphire Wafers by Using Optical Probes
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SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
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SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
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SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
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SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
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SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
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Non-Member Price: $187.00
